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ISPC Technology and Innovation, Philadelphia, USA |
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* Scientific Article * Impact Factor 6.630 |
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Faysal RG, Hadi AS, Litvinov AN, Bannov VY
ANALYSIS OF THERMAL FIELDS OF PRINTED CIRCUIT ASSEMBLIES. |
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Full Article: PDF
Scientific Object Identifier: http://s-o-i.org/1.1/TAS-02-34-10
DOI: http://dx.doi.org/10.15863/TAS.2016.02.34.10
Language: Russian
Citation: Faysal RG, Hadi AS, Litvinov AN, Bannov VY (2016) ANALYSIS OF THERMAL FIELDS OF PRINTED CIRCUIT ASSEMBLIES. ISJ Theoretical & Applied Science, 02 (34): 58-65. Soi: http://s-o-i.org/1.1/TAS-02-34-10 Doi: http://dx.doi.org/10.15863/TAS.2016.02.34.10 |
Pages: 58-65
Published: 29.02.2016
Abstract: Modeling of the stress-strain state (SSS) of the basic structural elements of radio electronics (RE) in the conditions actual operation is an urgent problem, whose solution allows the early stages of design to identify the most loaded elements of radio electronics (RE) and receive Design Technological solutions designed to optimize the design. The aim of this work is to increase the reliability and providing the required performance characteristics of product design RES technological method. A mathematical model of a real board RE with hinged elements that produce heat and under the influence of the operating mode of the heat. Mathematical modeling of the thermal field and SSS board based on the finite element method (FEM), implemented in the software package ANSYS. Achieved Mathematical modeling and analysis of thermal fields and SSS boards under the action of external thermal performance impacts. Most loaded area set board in which defects may develop mechanical origin, including latent conditions in RE. Proposed design -technological methods to reduce stress and improve thermo mechanical reliability design. The proposed model allows us to investigate the SSS of the boards with the real location and conditions of the outboard elements on it. We establish by mathematical modeling of the most loaded zone board and its components under operational thermal effects.
Key words: printed assembly, printed board, radio electronics, thermal effect, the temperature field, the stress-strain state.
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