Journal Archive * p-ISSN 2308-4944 (print) e-ISSN 2409-0085 (online) |
ISPC The development of electronics & mechanics, Barcelona, Venezuela |
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* Scientific Article * Scientific Article * Scientific Article * Scientific Article * |
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Antropov AN, Cheremnykh TA
INTERCONNECTIONS IN MULTILEVEL COMMUTATION SPACE SYSTEM IN PACKAGE – PCB. |
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Impact Factor 1.500 |
Full Article: PDF
Digital Object Identifier System: http://dx.doi.org/10.15863/TAS.2014.05.13.14
Language: Russian
Citation: Antropov AN, Cheremnykh TA (2014) INTERCONNECTIONS IN MULTILEVEL COMMUTATION SPACE SYSTEM IN PACKAGE – PCB. ISJ Theoretical & Applied Science 05 (13): 90-92. doi: http://dx.doi.org/10.15863/TAS.2014.05.13.14 |
Pages: 90-92
Published: 30.05.2014
Abstract: Optimization of interconnections in design by “Chip – package - PCB” technology is considered.
Key words: system on chip, system in package, interconnections, design.
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ISJ Theoretical & Applied Science